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SMT 6P Side Entry Modular Jack

"The Superior Performance and Versatility of the SMT 6P Side Entry Modular Jack: A Cost-Effective Solution for Enhanced Connectivity and Efficiency"

  • $500
    ≥1000
    Piece/Pieces
Payment Type:
L/C,T/T,Paypal
Incoterm:
FOB,CFR,CIF,EXW
1000
Min. Order:
1000 Piece/Pieces
Transportation:
Ocean,Air,Express
Port:
Shenzhen
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  • Product Description
Overview
Product Attributes

Model No.ATRJ5826A-6P6C-X-A-X

BrandAntenk

Place Of OriginChina

Interface TypeD-SUB(VGA)

HousingPlastic

PinBrass

PolesOther

ApplicationOther

CertificationCE

GenderMale

MaterialCopper

Support Card NumberOther

Operating FrequencyHigh Frequency

ClassificationWired Broadband Connection

Inner PackingTray

Supply Ability & Additional Information

Packagingbag packing,Tube packing, reel packing

Productivity2000K/Month

TransportationOcean,Air,Express

Place of OriginChina

Supply Ability2000K/Month

CertificateISO 9001-2015

HS Code8536909000

PortShenzhen

Payment TypeL/C,T/T,Paypal

IncotermFOB,CFR,CIF,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
bag packing,Tube packing, reel packing

Introducing the SMT 6P Side Entry Modular Jack, the ultimate solution for seamless connectivity! Designed with precision and innovation, this modular jack is the go-to choice for professionals seeking reliable and high-performance networking solutions. Its sleek and compact design allows for easy installation in tight spaces, making it ideal for various applications. With its six-pin configuration, this jack ensures fast and efficient data transmission, ensuring uninterrupted connections. Crafted with premium materials, it guarantees durability and longevity, even in demanding environments. Trust the SMT 6P Side Entry Modular Jack to revolutionize your networking experience and elevate your connectivity game to new heights!

SIDE ENTRY SMT JACK 6P


Specifications:

MATERIAL:
   1.HOUSING MATERIAL:GLASS FILLED POLYESTER UL94V-0.
   2.CONTACT MATERIAL :PHOSPHOR BRONZE t=0.35mm
   3.PLATING  SELECTING GOLD PLATING                                    
1u"~50u"OVER NICKEL IN CONTACT AREA.150u" TIN  PLATING
OVER NICKEL IN SOLDER AREA.
   4.SHIELD :0.25mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL 
ELECTRICAL:
   1.VOLTAGE PATING :125 VAC RMS.
   2.CURRENT PATING:1.5 AMP
   3.CONTACT RESISTANCE  :35  MILLIOHMS MAX 
   4.INSULATION  RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
   5.DIELECTRIC WITHSTANDING RESISTANCE: 1000V AC RMS 60Hz.1MIN
MECHANICAL:
   1.DURRABILITY:750 CYCLES MIN
   2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
   1.STORAGE : -40℃ TO +85℃ .
   2.OPERATION: -40℃ TO +85℃ .
   3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10  SECONDS)MATES WITH Modular Plug CONFORMING TO FCC PART 68 SUBPART F.
ATRJ5826A-6P6C-X-A-X

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